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Extra resources for IPC EIA J-STD-001C - Requirements for Soldered Electrical and Electronic Assemblies
Example text
Process controls are maintained in a manner assuring repeatability of assembly techniques. 4 Soldering to Terminals A solder fillet shall7 join the wire/lead to the terminal and shall7 show evidence of good wetting for a minimum of 75% of the minimum required wrap area. 2) the minimum solder fillet shall8 be 100% of the 90° wrap or straight through connection. 2 Cup Terminals (8) Table 11-1 #21b Class 1-No Reqt Class 2-Proc Ind Class 3-Defect For cup type terminals: 9 a. A fillet shall be formed along the surfaces of contact between the wire and terminal.
Properly wetted fillet shall be evident. 2 3 1 J 4 IPC-001c-9-004 Figure 9-4 1. 2. 3. 4. , Chip Resistor, Chip Capacitor, Square End MELF) Solder joints to components having terminations of a square or rectangular configuration shall1 (1) Table 11-1 #23 Class 1-Defect Class 2-Defect Class 3-Defect meet the dimensional and solder fillet requirements of Table 9-5 and Figure 9-5 for each product classification. The solder fillet may contact the bottom of the component. Table 9-5 Feature Maximum Side Overhang Dimensional Criteria - Rectangular or Square End Components Dim.
7 Notes: 1. 0906 in] thick, components with pre-established lead lengths, (DIPs, sockets), lead protrusion may not be visible. 2. 0984 in] if there is a possibility of violation of minimum electrical spacing, damage to soldered connections due to lead deflection or penetration of static protective packaging during subsequent handling or operating environments. 3 Coating Meniscus In Solder For Class 1 and 2 as an exception to Table 9-1, on the solder destination side the meniscus may be covered by solder but on the solder source side there shall1 be 360° (1) Table 11-1 #22a visible solder wetting and no visible Class 1-Defect coating meniscus in the solder connecClass 2-Defect Class 3-Defect tion.